偉利仕（上海）電子有限公司
公司地址：上海市閔行區閔北路288號
總 機：021-64064840
業務電話：13391139172
13818505445
傳 真：021-64065245
網 址: www.htgyqx.com
業務郵箱：sales@wellex.com.cn
BGA設備&能力 BGA Equipment & Capability
1、BGA工藝制程控制: BGA烘烤、錫膏回溫、網板印刷、爐溫
Process control of BGA assembly: Bulk BGA baking, warming-up solder paste, stencil printing, oven temperature.
2、BGA Z小間距：0.3MM
Minimum space between components：0.3MM
SMT 設備能力 SMT Capability
1、生產線貼裝產能：9500萬點/月
SMT line productivity: 95 million points per month
2、大PCB板尺寸：L = 510MM, W = 460MM
Maximum size of PCB: L = 510MM, W = 460MM
3、Z小PCB板尺寸：L = 50MM, W = 30MM
Minimum size of PCB: L = 50MM, W = 30MM
4、貼片PCB板厚度：0.4MM - 4MM (1-12層)
Thickness of PCB: 0.4MM - 4MM (1-12 layers)
5、貼片Z小尺寸：0201 (0.6*0.3MM）
Minimum component size for SMT: 0201 (0.6*0.3MM）
6、貼片大異型：33.5*33.5MM
Maximum component size for SMT: 33.5*33.5MM
7、芯片Z小間距：0.2MM
Minimum space between components：0.2MM
